Stay-Clean General Purpose Gel Solder Flux, 4 oz, Brush Cap Bottle, Tan/Gold

Description

Solder Paste Flux, General Purpose, 4 oz Container, Brush Cap Bottle Container, Gel Form, Composition: (2 to 15%) Ethylene Glycol, (1 to 10%) Ammonium Chloride, (5 to 30%) Zinc Chloride, (30 to 80%) Petrolatum, (1 to 10% ) Water, Tan/Gold, Odorless Odor, Flash Point >198 Deg C, 1.5 Evaporation Rate, 0.1 psig at 38 Deg C Vapor Pressure, Specific Gravity 0.815 to 0.88, Standards: A -A51145C Type 1 Form A, For Copper to Copper and Copper to Brass Connections, Soldering Tube Joints

Features

• Designed primarily for copper to copper and copper to brass connections the paste form is ideal for soldering tube joints. Not recommended for electrical or electronic applications due to the potential corrosive residue of the flux. Stay Clean Paste flux works well with most leaded and lead to free solder compositions. Flux residue should be removed after soldering.

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